尊龙凯时(中国)人生就是搏!

    COMPANY INTRODUCTION

    Anji Microelectronics Technology (Shanghai) Co., Ltd. (hereinafter referred to “ANJI”) is a high-end semiconductor materials company that takes independent innovation as its foundation and integrates R&D, production, sales, and technical services.

    ANJI focuses on the best solutions for processes and materials in the chip manufacturing process and has successfully established the “3+1” technology platform and its application fields, namely copper CMP slurries, barrier CMP slurries, dielectric (both silica-based and ceria-based abrasive) CMP slurries, tungsten CMP slurries, substrate CMP slurries, functional electronic wet chemicals, electroplating solution and its additives, achieving full platform coverage.

    ANJI has always firmly adhered to the development mindset of "taking technological innovation and intellectual property as the foundation", relying on the culture of “Innovation, Diligence, Sincerity, and Win-win", to provide customers with continuous high-quality products and technical solutions. It holds a mainstream supplier position in the domestic market and is strengthening the layout of overseas markets to meet the technical and industrialization needs of global wafer manufacturing and advanced packaging customers, and further enhance its global market share and brand awareness.


    HISTORY

    2004

    Anji’s birth, R&D Center established in Riverfront Harbor, Shanghai Zhangjiang Hi-tech Park

    2006

    The first HVM plant built up in Shanghai Jinqiao Export Processing Zone (South Zone)

    2008

    Breakthrough in high-end semiconductor materials in Mainland China, 1st PO received

    2009

    1st PO received from overseas customer

    2011

    Cu/Barrier CMP slurries adopted in 12" Fab as baseline

    2015

    Penetration to Taiwan Market, Taiwan Subsidiary established

    2017

    Anji Ningbo Subsidiary established as 2nd HVM base

    2019

    IPO on STAR Market in the first batch

    2021

    Three product platforms established:CMP Slurries, Functional Wet Chemicals, Electrochemical Plating

    2023

    R&D Center expanded and upgraded, integrated into Shanghai Jinqiao Comprehensive Bonded Zone

    2024

    The 20th anniversary of the company's establishment. Innovative leadership,forge ahead, sincere dedication, and win-win cooperation

    FUTURE

    Committed to building a greener, better and more sincere future
    2004
    2006
    2008
    2009
    2011
    2015
    2017
    2019
    2021
    2023
    2024
    FUTURE

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    CONTACT US

    Sales Contact Email: SC@xytjszp.com
    Ethics Complaints Email: MR@xytjszp.com
    Ethics Complaints Phone: +86 021-20693348